Itasca Selects European Research Paper for Top Award

Prestigious Award for Numerical Modeling to be Presented at FLAC/DEM Symposium

Minneapolis, MN (August 5, 2013) In recognition of the novel concepts and high-quality calculations contained in the paper, Itasca has selected, The Failure Envelope of a Bonded Particle Model for Rock in Three-Dimensional Stress Space, by Martin P. J. Schöpfer, Conrad Childs and Tom Manzocchi to receive the first Peter A. Cundall Award. The award is presented to the best overall paper submitted for presentation at the 3rd FLAC/DEM Symposium being held in October in Hangzhou, China. The award includes an invitation to deliver the paper as one of the keynote addresses before the worldwide audience at the Symposium.

Peter A. Cundall Award Winner, October 2013, FLAC/DEM Symposium
“The Failure Envelope of a Bonded Particle Model for Rock in Three-Dimensional Stress Space”
by Martin P. J. Schöpfer, Conrad Childs and Tom Manzocchi

Dr. Schöpfer, Department for Geodynamics and Sedimentology at the University of Vienna, wrote the paper with his colleagues Conrad Childs and Tom Manzocchi from the Fault Analysis Group, UCD School of Geological Sciences, at the University of Dublin.

The Peter A. Cundall Award is presented in honor of one of Itasca's Principal Software Developers. Dr. Cundall is responsible for creating the algorithms behind the software products that Itasca commercializes. He has been recognized for his brilliant achievements in numerical modeling throughout his extensive career. Itasca is a global, employee-owned, engineering consulting and software firm, working primarily with the geomechanics, hydrogeological and microseismics communities. We solve problems in many industries including mining, civil engineering, oil & gas, manufacturing and power generation.

Two honorable mentions were also awarded:

“Three-Dimensional Settlement Analysis of a Primary Crusher Station at a Copper Mine in Chile,” by Bogart Mendez, Rizzo Associates Chile S.A., Santiago, Chile and Diego Rivera, Rizzo Associates Inc., Pittsburgh, PA, USA; and

“REV and Equivalent Continuum/Discontinuum 3-D Stability Analyses of a Tunnel,” by Pinnaduwa H.S.W. Kulatilake and Q. Wu, University of Arizona, Tucson, Arizona.

The FLAC/DEM Symposium is hosted by Itasca every three years as a venue for Itasca software users to meet and share their experiences and results. Itasca produces two continuum codes, FLAC2D and FLAC3D, two discrete element codes, UDEC and 3DEC, and a particle flow /bonded particle code, PFC. This year the tourist city of Hangzhou, China will host the symposium, acknowledging the growing interest in Itasca products in Asia.